Sputtering Target Bonding Products Piezo electric Published literature search will need
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Sputtering Target Bonding Products Piezo electric Published literature search will needRectangular and Round Sputtering Target Bonding services offered. Backing plate designed and fabricated as per your specifications. Material: OFHC copper, Standard round Cu backing plate discs are 0. 125 in thickness. Backing plate diameter is 3 8" larger than Target diameter Available with Indium solder bonding for high thermal conductivity and cheaper Ag paste bonding Send us your CAD drawing for a quote Order with needed Sputter targets Price
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