RMA-042 T3-T6 - Sn42Bi58 low-temperature no-clean eutectic rosin mildly active solder paste (ROL0) F vapor degreaser or ultrasonic devices

vapor degreaser or ultrasonic devices

Precision Metal Loads: T3 & T4: Optimized at 86% for dispensing and 88

STIRRI-BGA-TF specialty no-clean universal tacky flux (ROL0) provides reliable soldering of BGA components

Activates immediately

Medium activity with QC-tracer effectively addressing BGA slumping issues

RMA-042 T3-T6 - Sn42Bi58 low-temperature no-clean eutectic rosin mildly active solder paste (ROL0) F vapor degreaser or ultrasonic devicesLow temp solder paste for electronics assembly using rosin mildly activated LT solder flux Used for attachment of temperature sensitive components to printed circuit boards, step soldering, warpage prevention, flexible circuits and large area array devices. Delivers reliable solder connections with low temperature reflow. Solders low Tg flexible boards and circuits used in phones, wearables and IoT devices Low temp BGA paste reduces HIP (head in